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Advanced Phenolic Epoxy Resin

Designed for advanced electronics and composite applications, Hebang advanced phenolic epoxy resin systems offer an integrated balance of heat resistance, low moisture absorption, dielectric performance, and long-term chemical stability.

DCPD Phenolic Epoxy Resin

This high-performance specialty epoxy resin contains both aromatic and dicyclopentadiene alicyclic structures. It combines heat resistance, low moisture absorption, low dielectric behavior, and strong adhesion after curing, with solid chemical stability.

Low Water Absorption Excellent Heat Resistance Chemical Stability

Core Applications

Electronic Materials CCL / PCB Semiconductor Packaging

Molecular structure of DCPD phenolic epoxy resin

Hebang Grade	Reference Grade	Epoxy Equivalent (g/eq)	Viscosity (ICI 150°C, Pa.s)	Softening Point (°C)
HBDP-2342	HP-7200L	242-252	0.02-0.05	50-60
HBDP-2353	HP-7200	254-264	0.04-0.1	56-66
HBDP-2361	HP-7200H	272-284	0.35-0.45	78-88
HBDP-2374	HP-7200HH	274-286	0.8-1.2	88-98

Biphenyl Phenolic Epoxy Resin

Built on a rigid biphenyl structure with relatively high functionality, this resin provides strong heat resistance, low moisture uptake, low dielectric properties, high adhesion, and intrinsic flame retardancy.

Low Dielectric Intrinsic Flame Retardancy High Heat Resistance

Core Applications

5G Electronic Materials Aerospace

Molecular structure of biphenyl phenolic epoxy resin

Hebang Grade	Reference Grade	Epoxy Equivalent (g/eq)	Softening Point (°C)	Remarks
HBBP-3342	NC-3000	265-285	53-63	low viscosity, low dielectric
HBBP-3343	NC-3000L	261-282	45-60	极low viscosity, low dielectric
HBBP-3351	NC-3000H	280-300	65-75	medium viscosity, low dielectric
HBBP-3374	NC-3100	280-300	90-105	high softening point, low dielectric

Triphenylmethane Epoxy Resin

This resin contains three glycidyl ether structures and a rigid aromatic backbone. After curing, it forms a dense three-dimensional network with high crosslink density, strong heat resistance, low moisture absorption, high mechanical strength, and reliable electrical insulation.

High Tg High Crosslink Density High Mechanical Strength

Core Applications

Advanced PCB Laminates Composites

Molecular structure of triphenylmethane epoxy resin

Hebang Grade	Reference Grade	Epoxy Equivalent (g/eq)	Viscosity (ICI 150°C, Pa.s)	Softening Point (°C)
HBTP-4341	EPPN-501H	162-172	0.05-0.11	51-57
HBTP-4352	EPPN-501HY	163-175	0.06-0.14	57-63
HBTP-4363	EPPN-502H	158-178	0.01-0.35	60-72