Advanced Phenolic Epoxy Resin
Designed for advanced electronics and composite applications, Hebang advanced phenolic epoxy resin systems offer an integrated balance of heat resistance, low moisture absorption, dielectric performance, and long-term chemical stability.
DCPD Phenolic Epoxy Resin
DCPD phenolic epoxy resin contains both aromatic rings and dicyclopentadiene alicyclic structures, making it a high-performance specialty epoxy resin. It combines excellent heat resistance, low moisture absorption, low dielectric constant, and strong adhesive sealing performance, while maintaining solid chemical stability after curing. It is mainly used in electronic applications such as copper clad laminates, epoxy molding compounds, high-Tg PCB laminates, and semiconductor packaging, and can also be used in high-temperature coatings, adhesives, and fiber composites.
Core Applications
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| Hebang Grade | Epoxy Equivalent (g/eq) | Viscosity (ICI 150°C, Pa.s) | Softening Point (°C) |
|---|---|---|---|
| HBDP-2342 | 242-252 | 0.02-0.05 | 50-60 |
| HBDP-2353 | 254-264 | 0.04-0.1 | 56-66 |
| HBDP-2361 | 272-284 | 0.35-0.45 | 78-88 |
| HBDP-2374 | 274-286 | 0.8-1.2 | 88-98 |
Biphenyl Phenolic Epoxy Resin
Built on a rigid biphenyl structure, this resin offers excellent heat resistance with a high glass transition temperature, low moisture absorption, low dielectric constant, strong adhesion, and intrinsic flame retardancy. Its core applications include 5G electronic copper-clad laminates, integrated circuit packaging, and epoxy molding compounds, while it can also be used in high-temperature coatings, adhesives, and carbon fiber composites for wind energy, aerospace, and other advanced scenarios.
Core Applications
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| Hebang Grade | Epoxy Equivalent (g/eq) | Softening Point (°C) | Remarks |
|---|---|---|---|
| HBBP-3342 | 265-285 | 53-63 | low viscosity, low dielectric |
| HBBP-3343 | 261-282 | 45-60 | 极low viscosity, low dielectric |
| HBBP-3351 | 280-300 | 65-75 | medium viscosity, low dielectric |
| HBBP-3374 | 280-300 | 90-105 | high softening point, low dielectric |
Triphenylmethane Epoxy Resin
This resin contains three glycidyl ether structures and a rigid aromatic backbone. After curing, it forms a dense three-dimensional network with high crosslink density, excellent heat resistance, low moisture absorption, high mechanical strength, and reliable electrical insulation. Its core applications are in electronics, including advanced PCB copper-clad laminates, integrated circuit packaging, and epoxy molding compounds, while it can also be used in aerospace composites, high-temperature coatings, and chemical anticorrosion equipment for high-end precision manufacturing scenarios.
Core Applications
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| Hebang Grade | Epoxy Equivalent (g/eq) | Viscosity (ICI 150°C, Pa.s) | Softening Point (°C) |
|---|---|---|---|
| HBTP-4341 | 162-172 | 0.05-0.11 | 51-57 |
| HBTP-4352 | 163-175 | 0.06-0.14 | 57-63 |
| HBTP-4363 | 158-178 | 0.01-0.35 | 60-72 |