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Bismaleimide Resins

Alkyl Diphenylmethane Bismaleimide

Alkyl Diphenylmethane Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Product Features

Alkyl Diphenylmethane Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Series
Bismaleimide Resins
Available Grades
1
High Tg Low Dielectric High Heat Resistance

Core Applications

Electronic Materials Composites

Representative Grades

HBMI9202
Molecular Structure Molecular Structure
Alkyl Diphenylmethane Bismaleimide molecular structure

Technical Specifications

Technical Specifications Data Sheet

型号 Purity (%) Mw 酸值 (mKOH/g) Appearance 熔点 (℃) Softening Point (°C) 凝胶化时间 (s) Df (10Ghz) Remarks
HBMI9202 ≥99 / <1 白色或淡黄色粉末 168±2 220°C/340s 0.00535 烷基链引入在保持High heat resistance的同时, 具有良好的溶解性及优异的介电性能