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Phenolic Epoxy Resins

Bisphenol F Epoxy Resin

Bisphenol F Epoxy Resin belongs to the Phenolic Epoxy Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include ≤3, Low viscosity度液体环氧, 粘度比128树脂低1/3. Typical applications include Electronic Materials, Composites.

Product Features

Bisphenol F Epoxy Resin belongs to the Phenolic Epoxy Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include ≤3, Low viscosity度液体环氧, 粘度比128树脂低1/3. Typical applications include Electronic Materials, Composites.

Series
Phenolic Epoxy Resins
Available Grades
1
≤3 Low viscosity度液体环氧 粘度比128树脂低1/3

Core Applications

Electronic Materials Composites

Representative Grades

HBEF-170
Molecular Structure Molecular Structure
Bisphenol F Epoxy Resin molecular structure

Technical Specifications

Technical Specifications Data Sheet

产品型号 Epoxy Equivalent (g/eq) Viscosity Hydrolyzable Chlorine (ppm) 总氯 (ppm) Color (Pt/Co) Remarks
HBEF-170 160-180 2000-5000 ≤300 ≤2000 ≤3 Low viscosity度液体环氧, 粘度比128树脂低1/3