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Bismaleimide Resins

Diisopropyl Bismaleimide

Diisopropyl Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Product Features

Diisopropyl Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Series
Bismaleimide Resins
Available Grades
1
High Tg Low Dielectric High Heat Resistance

Core Applications

Electronic Materials Composites

Representative Grades

HBMI9303
Molecular Structure Molecular Structure
Diisopropyl Bismaleimide molecular structure

Technical Specifications

Technical Specifications Data Sheet

型号 Purity (%) Mw 酸值 (mKOH/g) Appearance 熔点 (℃) Softening Point (°C) 凝胶化时间 (s) Df (10Ghz) Remarks
HBMI9303 / <3 黄色固体粉末或棕红固体 90-105 200°C/1500-2000s / 更好的溶剂溶解性, 低吸水性, Low dielectric, 高铜箔剥离强度