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Bismaleimide Resins

Diphenylmethane Bismaleimide

Diphenylmethane Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Product Features

Diphenylmethane Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Series
Bismaleimide Resins
Available Grades
1
High Tg Low Dielectric High Heat Resistance

Core Applications

Electronic Materials Composites

Representative Grades

HBMI9201
Molecular Structure Molecular Structure
Diphenylmethane Bismaleimide molecular structure

Technical Specifications

Technical Specifications Data Sheet

型号 Purity (%) Mw 酸值 (mKOH/g) Appearance 熔点 (℃) Softening Point (°C) 凝胶化时间 (s) Df (10Ghz) Remarks
HBMI9201 ≥90 / <1 黄色结晶粉末 160±2 220°C/70 / High heat resistance, 良好的力学性能及尺寸稳定性