Bisphenol A Epoxy Resins

Liquid Epoxy Resin

Liquid epoxy resin is a low-molecular-weight Bisphenol A epoxy resin system that offers strong adhesion, low curing shrinkage, and balanced mechanical, electrical, and chemical resistance performance for composites, insulation, and adhesive applications. Typical applications include Composites, Electronic Materials, Electrical Insulation, Adhesives.

Product Features

Series: Bisphenol A Epoxy Resins
Available Grades: 6

≤500 ≤200 Low hydro-a

Core Applications

Composites Electronic Materials Electrical Insulation Adhesives Coatings

Representative Grades

HBEL-127 HBEL-127E HBEL-128 HBEL-128E HBEL-128R HBEL-128S

Liquid Epoxy Resin molecular structure — **Molecular Structure** Molecular Structure

Technical Specifications

Technical Specifications Data Sheet

Grade	Epoxy Equivalent (g/eq)	Viscosity	Color (Pt/Co)	Hydrolyzable Chlorine (ppm)	Remarks
HBEL-127	176~184	8000~11000	≤20	≤500	Low-viscosity standard resin Low viscosity
HBEL-127E	176~184	8000~11000	≤20	≤200	Low-viscosity standard resin(Electronic grade) Low viscosity,Low hydro-a
HBEL-128	184~190	12000~15000	≤20	≤500	General-purpose standard resin Standard
HBEL-128E	184~190	12000~15000	≤20	≤200	General-purpose standard resin (electronic grade) Low hydro-CI
HBEL-128R	184~194	12000~16000	≤20	≤10000	Non-crystallizing grade Non-crystalizable
HBEL-128S	205~225	19000~24000	≤20	10000-25000	High-viscosity grade High viscosity