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Bismaleimide Resins

Phenoxy Bisphenol A Bismaleimide

Phenoxy Bisphenol A Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Product Features

Phenoxy Bisphenol A Bismaleimide belongs to the Bismaleimide Resins portfolio from Hebang Chemical and is supplied with stable technical specifications and batch consistency for industrial and advanced material applications. Key product features include High Tg, Low Dielectric, High Heat Resistance. Typical applications include Electronic Materials, Composites.

Series
Bismaleimide Resins
Available Grades
1
High Tg Low Dielectric High Heat Resistance

Core Applications

Electronic Materials Composites

Representative Grades

HBMI9203
Molecular Structure Molecular Structure
Phenoxy Bisphenol A Bismaleimide molecular structure

Technical Specifications

Technical Specifications Data Sheet

型号 Purity (%) Mw 酸值 (mKOH/g) Appearance 熔点 (℃) Softening Point (°C) 凝胶化时间 (s) Df (10Ghz) Remarks
HBMI9203 ≥99 / <1 黄色结晶粉末 163-166 220°C/730s / 保持High heat resistance的同时, 改性引入柔性结构提高固化物韧性