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Phosphorus-Modified Epoxy Resin

Developed for halogen-free flame-retardant laminates, electrical laminates, and advanced electronics, Hebang phosphorus-modified epoxy resin systems introduce DOPO structures to balance flame retardancy, heat resistance, low water absorption, and dielectric performance.

DOPO-PNE Modified Epoxy Resin

This DOPO-modified epoxy system balances flame-retardant efficiency with process adaptability and is suitable for halogen-free printed circuit substrates and electronic copper-clad laminate applications.

Flame Retardant High Heat Resistance High Tg

Core Applications

Electronic Materials CCL / PCB Electrical Laminates
Molecular structure of DOPO-PNE modified epoxy resin
Hebang Grade Appearance Solid Content (%) Epoxy Equivalent (g/eq) Phosphorus Content (wt.%) Viscosity @25°C (mPa.s) Remarks
HBEP-3140K75 Light yellow transparent liquid 75±1 280-320 2.9-3.1 ≤2000 Good flame retardancy
HBEP-3141K75 Light yellow transparent liquid 75±1 300-340 2.8-3.2 ≤3000 high heat resistance, Good flame retardancy
HBEP-3142AK70 Light yellow transparent liquid 70±1 340-380 2.9-3.1 ≤2000 high Tg, Good flame retardancy
HBEP-3143K70 Light yellow transparent liquid 70±1 340-370 2.9-3.1 ≤3000 Good flame retardancy

DOPO-HQ Modified Novolac Epoxy

Combining high reactivity, elevated Tg, and balanced dielectric properties, this resin can be supplied in cyclohexanone, acetone, or MEK-soluble systems to support advanced electronic material programs.

High Reactivity High Tg Balanced Dielectric Performance

Core Applications

Semiconductor Packaging CCL / PCB Electronic Potting
Molecular structure of DOPO-HQ modified novolac epoxy
Hebang Grade Appearance Solid Content (%) Epoxy Equivalent (g/eq) Phosphorus Content (wt.%) Viscosity @25°C (mPa.s) Remarks
HBEP-3250C80 Yellow transparent liquid 80±1 270-310 1.9-2.1 ≤1000 High reactivity, high Tg, cyclohexanone-soluble grade
HBEP-3251A70 Reddish-brown transparent liquid 70±1 300-340 1.9-2.1 ≤1000 High Tg, good dielectric performance, acetone-soluble grade
HBEP-3253A70 Reddish-brown transparent liquid 70±1 250-300 1.9-2.1 ≤1000 high reactivity, High Tg, good dielectric performance, acetone-soluble grade
HBEP-3254K70 Brown transparent liquid 70±1 300-340 1.9-2.1 ≤1000 High Tg, good dielectric performance, MEK-soluble grade

DOPO-NQ Modified Novolac Epoxy

Developed for electronic applications with demanding flame-retardant and heat-resistance requirements, this resin combines relatively high phosphorus content, thermal stability, and compatibility within resin systems.

High Tg Heat Resistance Flame-Retardant System

Core Applications

Halogen-Free CCL Electronic Materials
Molecular structure of DOPO-NQ modified novolac epoxy
Hebang Grade Appearance Solid Content (%) Epoxy Equivalent (g/eq) Phosphorus Content (wt.%) Viscosity @25°C (mPa.s) Remarks
HBEP-5370K75 Reddish-brown transparent liquid 75±1 300-340 2.4-2.6 ≤3000 High Tg, heat resistance