Bisphenol A Epoxy Resins

Solution Epoxy Resin

Product Features

This medium- to high-molecular-weight solution bisphenol A epoxy resin features low viscosity, easy solvent evaporation, high bonding strength, and strong mechanical performance. It is mainly used in copper clad laminate products, marine coatings, and anticorrosion coatings.

Series: Bisphenol A Epoxy Resins
Available Grades: 7

Max.1.0

Core Applications

Coatings Electronic Materials

Grades

HBSN-132X90 HBSN-134X80 HBSN-136X80 HSBN-2101A80 HBSN-2101X75 HBSN-2102X70

Molecular structure of solution epoxy resin — **Molecular Structure** Molecular Structure

Technical Specifications

Technical Specifications Data Sheet

Swipe horizontally to view all specifications

Grade	Epoxy Equivalent (g/eq)	Viscosity	Solid Content (%)	Gardner Color	Remarks
HBSN-132X90	210~230	——	89～91	Max.1.0	Solution resin Solution of semi-solid epoxy resin
HBSN-134X80	230~270	——	79～81	Max.1.0	—
HBSN-136X80	290~330	3000~7000	79～81	Max.1.0	—
HSBN-2101A80	450～500	2000~8000	79～81	Max.1.0	Solution resin Solution of solid epoxy resin
HBSN-2101X75	450～500	8000~15000	74～76	Max.1.0	—
HBSN-2102X70	600～650	8000~18000	69~71	Max.1.0	—
HBSN-2102X75	600～650	20000~50000	74~76	Max.1.0	—