Bisphenol A Epoxy Resins

Solution Epoxy Resin

Solution epoxy resin is formulated for coating and electronics applications that require controlled solid content, workable viscosity, and consistent processing performance. Typical applications include Coatings, Electronic Materials.

Product Features

Series: Bisphenol A Epoxy Resins
Available Grades: 7

Max.1.0

Core Applications

Coatings Electronic Materials

Representative Grades

HBSN-132X90 HBSN-134X80 HBSN-136X80 HSBN-2101A80 HBSN-2101X75 HBSN-2102X70

Solution Epoxy Resin molecular structure — **Molecular Structure** Molecular Structure

Technical Specifications

Technical Specifications Data Sheet

Grade	Epoxy Equivalent (g/eq)	Viscosity	Solid Content (%)	Gardner Color	Remarks
HBSN-132X90	210~230	——	89～91	Max.1.0	Solution resin Solution of semi-solid epoxy resin
HBSN-134X80	230~270	——	79～81	Max.1.0	—
HBSN-136X80	290~330	3000~7000	79～81	Max.1.0	—
HSBN-2101A80	450～500	2000~8000	79～81	Max.1.0	Solution resin Solution of solid epoxy resin
HBSN-2101X75	450～500	8000~15000	74～76	Max.1.0	—
HBSN-2102X70	600～650	8000~18000	69~71	Max.1.0	—
HBSN-2102X75	600～650	20000~50000	74~76	Max.1.0	—